• Materials conforms to IPC guidelines

This kit includes the tools and materials needed to reliably replace damaged lands, surface mount and BGA pads. The unique Circuit Frames used to replace these conductor patterns are made from rolled, annealed copper electroplated with tin. These Circuit Frame do not have an adhesive backing and are bonded to the circuit board surface using liquid epoxy supplied with the kit. You simply select the appropriate size pad or land, trim it from the Circuit Frame and bond it to the circuit board surface with epoxy. This kit that is specifically designed for Aerospace applications where out-gassing may be an issue. All the tools and materials are packaged in a rugged ESD safe carrying case.