• Ribbon bonding wedge for gold and aluminum wire
• For manual and semi-automatic bonders
• Vertical feed deep access
• Front/Back radius: .0015 x .005
• Foot type: Cross groove
• Ribbon size: .0005 thickness x .003 width
• Bond length: .0020
• Slot width: .0035 x .0037
• Foot finish: Matte (FR, BR & Bond flat)
• A10 Double Flat
• A8D option for enhanced wire control

DeWeyl's bonding wedge for microelectronics is designed for the placing and bonding of fine aluminum and gold wires during the assembly of integrated circuits. Ceramic offers a surface texture that couples with the wire giving optimum ultrasonic transfer. Difficult applications due to low bonding temperatures or a contaminated bond surfaces are made easier. It's used throughout the semiconductor, microwave, disk drive and hybrid electronic industries.