8327GL3 is a 1-part, silicone-free, ultra soft gel offering high thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the component/heatsink interface, ensuring all air is displaced and eliminating hotspots. Since the gel does not cure, circuits can be powered
up immediately following application, offering exceptional convenience.

It is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs.

Features & Benefits

• Thermal conductivity of 3.5 W/(mK)
• Flame retardant—meets UL94 V-0
• 1-part, non-curable, dispensable gel
• Silicone-free, will not contaminate surfaces
• Low modulus, ideal for aggressive thermal cycling conditions