Pace 8007-0586 Rework System, Infrared, BGA, IR3100, 120VAC, IR Series
Our Part #10061123
Condition:New
Mfr Part #8007-0586
Pace 8007-0586 Rework System, Infrared, BGA, IR3100, 120VAC, IR Series
Our Part #10061123
Condition:New
Mfr Part #8007-0586
- Description
- Specifications
- Documents
- Non-Contact IR Pyrometer
- Ultra-High Precision Placement Capability
- High Sensitivity Vacuum Pick
- Sodr-Cam Reflow Camera
- Height Adjustable Bottom-Side Preheater
- High-Definition Optical Alignment System
- Quad-Field Imaging for Large/Fine Pitch BGA's
- Integrated Board Support Wand
- Power Distribution Graph
- Sensor Offset
The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip, and other SMDs. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3100 does not require nozzles. A specially developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. A Sodr-Cam Reflow Camera comes standard, allowing you to watch the entire reflow process in real time. The IR 3100's newly designed Windows-based software makes profiling incredibly simple for even the most advanced applications, providing intuitive set-up, multi-stage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage, and much more.
■A closed-loop, non-contact IR pyrometer monitors and controls the ramp rate and temperature of the component in real-time, by controlling the top and bottom heaters’ output throughout the heating process. ■Motorized reflow head is driven by advanced stepper motor system providing smooth, high precision, repeatable movement with no drift, allowing for soft landing of components and 28µm (.0011") placement accuracy. ■New Vacuum Pick design is more robust, utilizes an optical sensor, is counterweight balanced, and employs precision high-temperature linear ball bearings for maximum accuracy and sensitivity in placement and pick-up. ■Provided Sodr-Cam allows the operator to verify the entire reflow process, including the exact moment of solder melt. High powered (1000W) IR preheater height is adjustable from standard position up to 38mm (1.5") closer to the PCB for the most challenging high-thermal mass boards. ■Automated Vision Overlay System uses a beam-splitting prism, high intensity LEDs for shadow-free lighting and a new high definition 1080p camera for easy alignment. ■Allows up to four corners of a large component (and its lands) to be viewed under high magnification, providing perfect alignment of outsized BGAs or fine-pitch QFPs. ■Prevents warping or sagging during reflow, is extremely adjustable to clear parts on the bottom of PCB and is easily removable when not in use. ■Provides a graphical analysis of the top heater output within each zone, helping the developer make necessary adjustments to either the bottom heater utilization, or ramp rate, to maximize thermal performance. ■Allows the developer to easily match the pyrometer temperature reading to the actual solder temperature.