
$EACH
- Description
- Specifications
- Prevents burning, warping PCB's in rework.
- Prevents lifting pads during rework.
- No need for nozzles to remove SMD's.
- Remove thru-hole chips & connectors easier
- Prevents high temp damage to I.C's & caps
- Eliminates sticky de-solder wick with BGA's.
- De-clogs your de-soldering tools quickly.
- ReDress weak BGA pads without wick/braid.
Brand:Â Zephyrtronics
Lead Type:Â Lead Free
Series:Â LowMelt Series
Lead Free:Â Yes
Melting Point: 302°F
Package Type:Â Dispenser Tube
$EACH