• UT Series is the solution for standard bonding applications
• For deep access applications VBN, VR=6350 MD=107. Provides vertical clearance between adjacent high loop profile and die edge.
• Fine matte tip finish provides better stitch adhesion and ensures smoother exit of wire during looping
• Alumina Zirconia properties: Hardness (HV1) 2000; Grain size µm <0.9; Density g/cm³ 4.25

SPT utilizes a state-of-the-art Ceramic Injection Molding (CIM) technology in the creation of its wire bonding capillaries, which meets tight tolerances. The UT capillary series is geometrically designed for non-fine pitch, gold and copper wire applications. Gold-to-copper wire conversion for wire bonding interconnect lowers manufacturing costs and has become the major direction of semiconductor packaging assembly companies. The UT design has become an ideal choice for LED (light emitting diodes) application.