CircuitMedic
CircuitMedic B6-324-2323-100 Flextac Rework Stencil, Polymer, BGA, 324 Balls, 23mmx23mm, 10/Pkg
Our Part #246SO423
Condition:New
Mfr Part #B6-324-2323-100
CircuitMedic
CircuitMedic B6-324-2323-100 Flextac Rework Stencil, Polymer, BGA, 324 Balls, 23mmx23mm, 10/Pkg
Our Part #246SO423
Condition:New
Mfr Part #B6-324-2323-100
$129.00Pack
Multiples of: 5
- Description
- Specifications
- Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
- Laser cut ensures precise aperture size
- Eliminates tedious stencil cleaning (Disposable)
- Conforms to the board surface (Flexible)
- Fold-up sides for easy placement and solder paste containment
- Low cost
- Packaged in a handy ESD safe carrying case
Brand: CircuitMedic
Material: Polymer
Applications: Applying Solder Paste for BGA Rework
Component Length: 40.000 mm
Component Width: 40.000 mm
ESD Safe: Yes
Mounting Type: BGA
Number of Balls: 324
Package Quantity: 10 Per Pkg.
Pitch: 1 mm
Product Type: Flextac Rework Stencils
Series: B6 Series
Thickness: 0.004 in.
$129.00Pack
Multiples of: 5