• Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed
• Laser cut ensures precise aperture size
• Eliminates tedious stencil cleaning (Disposable)
• Conforms to the board surface (Flexible)
• Fold-up sides for easy placement and solder paste containment
• Low cost
• Packaged in a handy ESD safe carrying case

Circuit Frames replace damaged surface mount pads, lands, and conductors. Circuit Frames have a dry-film adhesive backing cured in 30 seconds using heat from a bonding Iron. The replaced pad, land, or conductor has a bond strength equal to the original, and no messy liquid epoxies are used for bonding.

This reliable IPC-recommended procedure meets the highest conformance level for circuit board rework or repair. For over 40 years, Circuit Frames have been used by thousands of commercial, medical, and military manufacturers around the globe.