• Eutectic alloy (liquidus = solidus temperature)
  
• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  
• Flux meets J-STD-004B
  
• Spreads like rosin-activated flux
  
• Virtually non-splattering
  
• Non-corrosive residue
  
• Non-conductive residue
  
• Halide free

The 4860–4867 Sn63/Pb37 No Clean Solder Wire is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.