• Excellent wetting reflow in air
• Probe-testable residue
• Extended open time
• Consistent fine-pitch printing
• Strong initial tack strength and long-term stability
• High humidity resistance
• Halogen-free

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

NC-SMQ92J Solder Paste

NC-SMQ92J is a halogen-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multi-point probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ92J will perform well on high-speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications, and Bellcore test criteria.