• Low-spatter formulation
  
• Light-colored residue
  
• Compatible with Pb-free and SnPb alloys
  
• Available within Indalloy®292C alloy
  
• Compatible with HASL, Immersion Silver, ENIG and OSP surface finishes

Indium Corporation’s CORE 230-RC is a formula developed to meet the demanding requirements of robotic and laser soldering. It incorporates a highly effective activator package with new “no spatter” technology in a high-reliability flux media. CORE 230-RC is fully REACH-compliant, containing no REACH substance of very high concern (SVHCs). 

No-Spatter, No-Clean, REACH-Compliant Robotic Soldering Wire

Indium Corporation’s CORE 230-RC is a formula developed to meet the demanding requirements of robotic and laser soldering. It incorporates a highly effective activator package with new “no-spatter” technology in a high-reliability flux media. CORE 230-RC is fully REACH-compliant, containing no REACH substance of very high concern (SVHCs). CORE 230-RC is not used solely for robotic and laser soldering since it also performs exceptionally well in hand soldering applications. The no-spatter feature eliminates flux spatters that can burn operators’ hands.

Process Recommendations

• Match the tip size to the part to be soldered
• Apply the solder wire to the joint, not to the soldering iron tip
• Use the lowest temperature possible
• 610–700°F (320–370°C) for SnPb and Pb-free
• Surface mount (SMT) soldering should be completed in 1–2 seconds
• Plated through-hole (PTH) soldering should be completed in 1–3 seconds
• The robotic soldering process set-up is highly customizable and depends on the assembly being soldered
• A smooth solder joint appearance requires the correct amount of temperature and time; fine-tuning the process parameters may be required to achieve the best possible outcome
• During robotic soldering, flux build-up and charring may occur; to avoid build-up, increase the iron tip cleaning frequency or reduce the iron tip temperature

All of Indium Corporation’s no-clean fluxes, including this formula, are designed to be electrically safe under normal consumer electronic and telecommunication operating conditions. Unless otherwise specified, electrically safe means that the post-soldering residues pass J-STD-004B SIR and ECM testing.

Indium Corporation’s cored solder wire has been designed to be fully compatible with our solder paste, wave fluxes, and rework fluxes, and is also expected to be compatible with many of our competitors’ products. For example, CORE 230-RC flux-cored wire solder is not only compatible with Indium8.9HF Solder Paste, but also with our 5.2LS, 8.9 series, 92 series, and 10 series products. Indium Corporation determines compatibility primarily by matching flux chemistry. However, a select number of wave, reflow, and rework product combinations have been thoroughly tested to ensure that the combined flux residues meet the electrical and reliability requirements of IPC J-STD-004B.