• Lowest voiding water-soluble flux for solder paste:
• Exceptional printing process window:
• Wide reflow process window for profiling
• Excellent wetting on a variety of surface finishes
• Maintains track over time
• Suitable for SnPb eutectic alloys as well as Pb-free alloys

Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response to pause. Indium6.4R exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with the fewest voids, reduced size of largest voids.