• High electrical conductivity
• High thermal conductivity
• Uniform bondline adhesion
• Custom preforms available
• Adhesion with flexibility
• Void-free bondline
• Clean, easy application with no waste
• Even heat dissipation
• Provides electrical continuity
• Minimum thermal resistance to heat sink
• Passes NASA outgassing

LOCTITE® ABLESTIK CF 3350 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance. LOCTITE® ABLESTIK CF 3350 passes NASA outgassing standards.