
Hazardous
- Description
- Specifications
- Documents
- Bonds strongly to metal, glass and many plastics
- Cures with LED exposure (365 – 405nm)
- Can cure up to 5mm thick, ideal for encapsulation
- Secondary moisture cure
- Low viscosity, easily wets out horizontal surfaces
The MG Chemicals UVLED82-1L adhesive is specially formulated to cure using both broadband and LED light sources such as 365, 385, 395 and 405nm. This product is ideal for edge bonding chips and other circuit components when high throughput is needed. The low viscosity coupled with depth of cure enables encapsulation of parts up to a thickness of 5mm (1/5”). The adhesive contains a secondary cure mechanism that allows for curing in shadowed areas.
Brand: MG Chemicals
Applications: Edge bonding chips; Read/write heads on disk drives; Camera modules; Fibre optic connectors, couplers and isolators; Bonding Photovoltaic cells; PCB encapsulation; Glob top
Container Volume: 945 mL
Dielectric Breakdown: 44900 V
Dielectric Strength: 360 V/Mil
Hardness: 77 D
Operating Temperature Range: -40-135°C
Package Type: Can
Product Type: Light Curing Adhesive
Product Weight: 13 lb.
Resistivity: 3.0 x 10¹³Ωcm
RoHS Compliance: Yes
Shear Strength: 6.2 N/mm²
Tensile Strength: 30 N/mm²