• High thermal stability
• Improves soldering performance
• Eliminates the need and expense of cleaning
• Classified as ROL1 per J-STD-004, J-STD-004A & J-STD-004B

Kester 186 Soldering Flux, under MIL-F-14256, was QPL approved as Type RMA. The flux residue after soldering is non-corrosive and non-conductive. 186 rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. This flux possesses high thermal stability for soldering multi-layer assemblies which may require a high preheat temperature or longer temperature dwell time. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.