• Minimize micro-solderballs
• Extremely shiny joints
• No streaky, white residues
• Improves soldering performance
• Eliminates the need and expense of cleaning
• Classified as ORL0 per J-STD-004

Kester 959 is a no-clean, non-corrosive, liquid flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. Kester 959 was developed to minimize the formation of micro-solderballs during wave soldering operations. This flux contains a small percentage of rosin (1%), which improves solderability, heat stability and surface insulation resistance. Kester 959 offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry. Kester 959 leaves evenly distributed residues for the best cosmetic appearance.