AIM Solder
AIM Solder 21602 Solder Paste, Water Soluble, Lead Free, T4, 88.5%, Sn96.5Ag3Cu0.5, 500g Jar
Our Part #592-455
Condition:New
Mfr Part #21602
AIM Solder
AIM Solder 21602 Solder Paste, Water Soluble, Lead Free, T4, 88.5%, Sn96.5Ag3Cu0.5, 500g Jar
Our Part #592-455
Condition:New
Mfr Part #21602
Next Day Air Only
$130.00EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $130.00 | |
| 5 | $123.50 | Save 5% |
| 10 | $119.60 | Save 8% |
| 20 | $114.40 | Save 12% |
Next Day Air Only
- Description
- Specifications
- Excellent wetting
- Extended cleaning window
- Superior slump resistance
- Large process window
- Aqueous wash with water
- J-STD-004 ORM1
AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life.
Brand: AIM Solder
Alloy: Sn96.5Ag3Cu0.5
Flux Type: Water Soluble
Lead Type: Lead Free
Powder Mesh Size: T4
Metal %: 88.5 %
Package Type: Jar
Volume: 500 g
Series: WS488 Series
Alternate Product Number: SAC305
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Lead Free: Yes
Package: 500g Jar
Type: Solder Paste
Water Soluble: Yes
$130.00EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $130.00 | |
| 5 | $123.50 | Save 5% |
| 10 | $119.60 | Save 8% |
| 20 | $114.40 | Save 12% |