The Pace's TJ-70 Mini ThermoJet provides safe, rapid installation or removal of chip components, SOT's, SOIC's, PLCC's, QFP's and other surface mounted devices via controlled convective/hot air. A finger-actuated air switch and IntelliHeat Control provide safe, "instant use" capability without constant running of an air pump. The TJ-70's pencil grip design lets you target controlled heat right at the solder joints without affecting adjacent components solder or damaging the pc board. Also effective for heat shink tubing applications and for conformal coating removal via convective softening of urethanes/over-curing of epoxies. For use on IntelliHeat-compatible systems only.