• High oxidation barrier to eliminate graping and HIP defects
• Highly probe-testable flux residue
• Halogen-free per EN14582 test method
• Excellent print transfer efficiency on 0.4mm pitch CSPs

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium8.9HF1 Pb-Free Solder Paste

Indium8.9HF1 is an air reflow, no-clean solder paste. Indium8.9HF1 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF1 minimizes false failures in ICT.