• Formulated for use with the eutectic 58Bi/42Sn, 57Bi/42Sn/1Ag, and 57.6Bi/42Sn/0.4Ag alloys
• Low-temperature Pb-free solution
• Clear residue
• Exceptional wetting in air reflow
• Halogen-free

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium5.7LT Solder Paste

Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT, in combination with the SnBi alloy, can be especially useful as a low-temperature, Pb-free solution.