• Wide reflow process window
• Clear residue
• Low-voiding
• Industry leading response-to-pause performance
• Outstanding print characteristics and long stencil life
• Excellent wetting to Pb-free PCB metallizations

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium5.1 Solder Paste

Indium5.1 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other Pb-free alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high-speed, as well as high-mix, surface mount lines. In addition to consistent printing and reflow requirements, this paste offers superb wetting to Pb-free metallizations in combination with clear residue and low-voiding on microvia.