• Quantity: 5 gallons
• ORL0 per J-STD-004A
• Compatible with all common Pb-free and SnPb wave soldering alloys
• Superior hole fill
• No post-soldering green corrosion
• Low degree of solder balling
• Non-flammable and non-corrosive

WF-7745 is a water-based, VOC-free, halogen-free, no-clean wave solder flux designed for wave soldering through-hole, bottom-side surface mount and mixed-technology circuit boards. It performs well with both Pb-free and SnPb solders and processes. WF-7745 is non-flammable, dramatically reducing volatile organic compound emissions and eliminating special flammable storage conditions. WF-7745 easily passes the IPC TM-650 copper mirror test. It also passes the IPC TM-650 copper corrosion test, showing no evidence of green. This high degree of corrosion resistance is virtually unheard of with water-based no-clean fluxes. Even with this high degree of corrosion resistance, WF-7745 solders as well as many halogen-containing, low solids, no-clean fluxes, yielding superior hole-fill and reduced solder balling.
WF-7745 is a colorless liquid, containing no rosin. The blend of water and VOC-free surfactants ensures an even distribution of flux solids both during storage and during spray flux deposition. The specific gravity of WF-7745, 1.014 @ 25°C, is just slightly higher than that of pure water. However, in contrast to higher solids content fluxes, specific gravity is not the best method to assign quality standards for WF-7745. This is because the flux solids content is relatively low. While in-process quality control of WF-7745 is not generally required, the best method is to ensure both solids content and activity level is by acid value titration.